Pure silicon has been studied by the semiconductor industry for years and is believed by many to be the answer to the debilitating heat generated by today's computers that results in slower processing speed. There are patents on the use of this pure silicon material in wafer manufacture, but no one has been able to purify the gas that silicon is made from at a reasonable cost or in the quantities needed for commercial application.
Tenoroc's nozzle separation method is a good fit for purifying silicon because of the weights and condensation temperatures of its isotopes. Silicon is composed of three isotopes, Si28, Si29, and Si30. Si28 is approximately 92% of the mix. Because both Si29 and Si30 weigh more in their gaseous state than Si28, and condense at a higher temperature than Si28, they are more easily separated with a curved nozzle that causes a massive weight difference through targeted condensation and imparts massive centrifugal force. The process can be further enhanced with an aggressive "cut" at the nozzle skimmer which would take some of the gaseous Si28 along with the condensed Si29 and Si30, ensuring isotopically pure Si28. The separated, non-isotopically pure mix can still be used for less demanding applications.
The Tenoroc nozzle could be the answer to the ongoing industry challenge of heat buildup, facilitating the production of faster microprocessors.